Tensilica HiFi 3z DSP IP Core Provides Enhanced Voice and Audio Processing

July 28, 2017 Circuit Cellar Staff

Cadence Design Systems has announced the Cadence Tensilica HiFi 3z DSP IP core for system-on-chip (SoC) designs targeted for the latest mobile and home entertainment applications, including smartphones, augmented reality (AR)/3D goggles, digital TVs and set-top boxes (STBs). The new … Continue reading

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